Final polisher PNX332B

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SERIES line-up
PNX332B/312 _________________________________________________________________________________________________________________________________
CONCEPT
The final polisher tool features very unique polishing head and handling structure which enable high accuracy and high throughput stably. __________________________________________________________________________________________________________________________________
Feature
Best Seller 300mm Final Polisher:
  • Widely recognized for its superior performance in final polishing.
Ultra Mirror & Luminance Surface:
  • Achieves atom-level surface finish with ultra-mirror quality and high luminance.
3-Platen Polishing Stage:
  • Features 1st, 2nd, and 3rd platens, polishing 6 wafers simultaneously.
Ideal for Reclaim & TSV Wafers:
  • Perfect for reclaim wafers and TSV wafers, which require significant polish removal.
PNX312 Fully Automatic Polisher:
  • Fully automatic, 1-platen type polisher for efficient, consistent polishing.
Uses of the Final Polisher PNX332B
  1. Semiconductor Manufacturing:
    • Final polishing of silicon wafers, ensuring ultra-smooth surfaces for high-performance semiconductor devices.
  2. TSV and Reclaim Wafers:
    • Ideal for polishing TSV (Through-Silicon Via) wafers and reclaim wafers that require significant material removal.
  3. Optical Surface Finishing:
    • Provides high-luminance, mirror-like finishes for optical substrates, enhancing performance in photonics and optics applications.
  4. MEMS and Sensor Fabrication:
    • Prepares smooth, uniform wafer surfaces for microelectromechanical systems (MEMS) and sensor devices.
  5. Compound Material Polishing:
    • Suitable for polishing compound materials like sapphire, SiC, and GaAs, used in advanced electronic and optoelectronic devices.
  6. High Precision Applications:
    • Achieves atom-level precision, making it ideal for applications requiring the highest surface quality.
  7. Research & Development:
    • Used in R&D labs for developing new materials and devices, particularly those needing ultra-fine surface finishes.