In-line grinder for less than 25um thickness GDM300
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SERIES line-up
GDM300 _________________________________________________________________________________________________________________________________CONCEPT
For thin wafers, Grinding/Polishing/Detape fully automatic process by 1 machine. __________________________________________________________________________________________________________________________________Feature
- Fully automated systems enable continuous processing from back grinding to wafer mounting, achieving wafer thicknesses as thin as 25µm.
- The dual-head polishing stage significantly increases throughput, nearly doubling the performance compared to single-head systems.
- An optional built-in edge trimming system is available, ideal for thin wafer processing applications.
- The dual-index system separates the polishing and grinding stages, ensuring the cleanliness required for TSV and MEMS processes.
- Achieves ultra-mirror surfaces with a luminance of less than Ra1Å for exceptional quality.
Uses
- Semiconductor Manufacturing: Ideal for producing thin wafers used in advanced semiconductor devices.
- MEMS and TSV Applications: Designed to meet the strict cleanliness and precision requirements of MEMS (Micro-Electro-Mechanical Systems) and TSV (Through-Silicon Via) technologies.
- High-Performance Devices: Supports the production of components for high-speed, high-capacity devices such as smartphones, servers, and memory chips.
- Optoelectronic Applications: Suitable for fabricating wafers used in LEDs, sensors, and other optoelectronic components.
- R&D Facilities: Widely used in research and development for innovative semiconductor technologies.
