Grinder for brittle material SVG401MKⅡ

_____________________________________________________________________________________________________________________
SERIES line-up
SVG101MKⅡ・SVG401MKⅡ・SVG401H _________________________________________________________________________________________________________________________________
CONCEPT
Best solution for brittle material grinder. __________________________________________________________________________________________________________________________________
Feature
SVG101 Series (Manual Grinder for R&D)
  1. Shuttle Table Design: Simplifies wafer loading and unloading.
  2. Ideal for R&D: Designed for research and development purposes.
VG401 Series (High-Power Grinder)
  1. High-Rigidity Spindle: Ensures stable and precise grinding.
  2. Powerful Motor: Supports continuous grinding of brittle materials like sapphire, SiC, and compound semiconductors.
Large Chuck Table: Supports up to φ450mm wafers and batch processing (e.g., 20 × φ3-inch wafers).
Uses of the Grinder for Brittle Material SVG401MKⅡ
  1. Brittle Material Processing:
    • Designed for grinding materials like sapphire, SiC, and compound semiconductors.
  2. High-Precision Grinding:
    • Ensures minimal damage and high accuracy for fragile materials.
  3. Continuous Grinding:
    • Supports uninterrupted grinding for efficient production workflows.
  4. Large Wafer Handling:
    • Handles wafers up to φ450mm, suitable for both small and large-scale operations.
  5. Batch Processing:
    • Ideal for processing multiple small wafers simultaneously (e.g., 20 × φ3-inch wafers).
  6. R&D and Production:
    • Suitable for research, prototyping, and mass production in semiconductor and optoelectronic industries.
  7. Material Customization:
    • Adapts to various brittle and compound materials used in advanced electronic