450mm wafer final polisher PNX1200/PNX1200S
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SERIES line-up
PNX1200・PNX1200S _________________________________________________________________________________________________________________________________CONCEPT
World's first fully automatic final polisher for 450mm wafer __________________________________________________________________________________________________________________________________Feature
Innovative Design for 450mm Wafers:- Adopts a new machine design concept to support 450mm wafers.
- Features three platens (1st, 2nd, 3rd) for simultaneous polishing of six wafers.
- Ideal for reclaiming wafers and TSV wafers requiring substantial polish removal.
- Single-table manual polisher designed for precise, small-scale polishing needs.
Uses of the 450mm Wafer Final Polisher PNX1200/PNX1200S
- Final Polishing for 450mm Wafers:
- Delivers ultra-smooth surfaces for advanced semiconductor applications.
- Wafer Reclaim Processing:
- Removes defects and restores surfaces of reclaim wafers for reuse.
- TSV Wafer Polishing:
- Optimized for through-silicon via (TSV) wafers, ensuring precise material removal.
- High-Volume Production:
- Designed for large-scale manufacturing with consistent quality and efficiency.
- Material Compatibility:
- Suitable for polishing silicon, SiC, sapphire, and compound semiconductor wafers.
- Support for Advanced Packaging:
- Prepares wafers for 3D integration, flip-chip, and other cutting-edge packaging technologies.
- Research and Development:
- Ideal for R&D applications requiring high precision and surface quality.
- Enhanced Surface Performance:
- Reduces surface irregularities, enhancing wafer reliability and device performance.
